PV Automation
Photovoltaic power Dell XPS M1330 Battery generation will become the future pillars of power and direction. As China’s “Renewable Energy Law” was promulgated, as well as the past two years the size of China’s photovoltaic industry, the rapid expansion of production equipment sales also increased significantly. 2006 domestic sales of photovoltaic devices reach 6 billion yuan, increased 76.6% compared with 2005. Is expected in 2007 sales of domestically produced equipment, photovoltaic cells will be more than 700 million yuan.
The gap between various types of domestic equipment and international mixed
PECVD production capacity and technological Dell XPS M1730 Battery level has been close to the world advanced level, get more and more domestic customers to use, but the degree of automation equipment (automatic loading and unloading film) with foreign countries there are still gaps.
Automatic screen printing machine can not achieve a breakthrough in core technology, the overall level and a big gap between foreign and domestic production lines used almost all of the high cost of imported equipment.
Material growth and device performance of single-crystal furnace in technology with the international advanced level although there are gaps, but not great, and have the price advantage of the opportunity with a shortage of silicon material, the device has developed mass Dell Inspiron E1405 Battery production, accounting for the domestic market and exported a small amount of .
R & D of large-size thin wafer automation equipment
The development of photovoltaic cell manufacturing equipment is designed to improve the quality of the final products of the battery, the entire line of photoelectric conversion efficiency and production efficiency, while reducing production costs, therefore, future devices technology Dell Latitude D410 Battery development will revolve around the following aspects:
First of all, the further development of appropriate large-size (such as the current mainstream is 156mm × 156mm square polycrystalline silicon and future 210mm × 210mm square silicon chip, etc.), thin wafer process technology and equipment (currently the mainstream silicon thickness of 210μm-240μm), in order to to save silicon and reduce costs.
Secondly, to improve stand-alone level of automation, increasing the amount dell D5318 of batch loaded films in order to improve stand-alone productivity. The current mainstream 156mm × 156mm square polycrystalline silicon wafer production process, for example, to develop stand-alone production capacity of 50MW production equipment at the same time, to achieve the Robot Automatic transmission line inspection and other functions, the entire line to improve production efficiency, reduce manual intervention, reducing fragmentation.
Third, to enhance the stability of equipment operation. According to the survey, the domestic equipment MTBF (Mean Time Between Failures) generally, in 500 hours, while the MTTR (MTTR) is about 10 hours, far below the 3,500 foreign MTBF and MTTR hours 8 hours. Although the maintenance dell F287F of domestic enterprises with a fast response, easy maintenance and so on, but the fault more difficult to repair remains a common problem of domestic equipment, therefore, domestic production was introduced in the device reliability design, analysis, manufacturing, technical content, it is very important to .
